Abstract

500+ MHz designs using deep-submicron (DSM) copper interconnects require accurate and efficient modeling of cladding-metals’ frequency-dependent impedance [1]. In this paper, for the first time, we simulate and describe the current distribution inside a copper-based interconnect in a rich set of multi-line structures. The difference of the resistivities of copper alloy and the cladding metals causes a non-monotonic current density versus cross-wire axis relation. The same situation does not occur for the state-of-the-art aluminum processes. It enlarges the inductance by more than 12 percent. Simulating the frequency dependence of the inductance with this property, we find that PEEC [2][3] can simulate cladded wire profile to achieve accurate inductance extraction. Other approximate methods result in inaccurate and lower inductance values. A new modeling methodology based on library look-up is then proposed to …

Metadata

publication

Proceedings of the 2000 international symposium on Physical design, 117-120, 2000

year

2000

publication date

2000/5/1

authors

Li-Fu Chang, Keh-Jeng Chang, Robert Mathews

link

https://dl.acm.org/doi/pdf/10.1145/332357.332386

resource_link

https://dl.acm.org/doi/pdf/10.1145/332357.332386

book

Proceedings of the 2000 international symposium on Physical design

pages

117-120