Abstract

We propose a novel optical I/O design called ‘Backside Optical Coupler (BOC)’ featuring mechanically stable fiber housing arrays providing high-channel density and high fan-in capabilities on the backside of the wafer. Using an all-dielectric Distributed Bragg Reflector (DBR) for light containment, the BOC uses an efficient rib waveguide grating structure for coupling. The approach offers the flexibility to improve coupling efficiency for different wavelength ranges and suppress polarization-dependent losses. In addition, this design provides less clutter on the topside and edges of the chip, allowing flexible fiber-to-device integration on a V-groove. Under the TE-optimized BOC design, our results show a coupling efficiency of -0.78dB with wavelength-dependent loss as low as 0.5dB over the C-band (1550nm). Our structure is analogous to an electrically packaged ball-grid-array (BGA) interconnect.

Date

May 30, 2023

Authors

Sugeet Sunder, Akhilesh Jaiswal, Ajey Jacob

Conference

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

Pages

727-731

Publisher

IEEE