Abstract

Enabling cost-effective and power-efficient laser source on a silicon photonics (SiPh) platform is a major goal that has been highly sought after. In the past two decades, tremendous effort has been made to develop various on-chip integration techniques to enhance SiPh circuits with efficient light-emitting materials. Here we review our recent advancements in hybrid flip-chip integration of III-V lasers on a 300-mm monolithic SiPh platform. By leveraging advanced complementary metal oxide semiconductor (CMOS) manufacturing processes, we have demonstrated wafer-scale laser attach based on a precisely controlled cavity formed on a silicon-on-insulator (SOI) substrate. The laser integration process is aided by precise mechanical alignment features on the SiPh wafer and high-precision fiducials on the laser. Efficient laser-to-SiPh-circuit butt-coupling with optical power up to 20 mW was demonstrated through …

Date

January 19, 2023

Authors

Yusheng Bian, Koushik Ramachandran, Zhuo-Jie Wu, Brittany Hedrick, Kevin K Dezfulian, Thomas Houghton, Karen Nummy, Daniel W Fisher, Takako Hirokawa, Keith Donegan, Francis O Afzal, Monica Esopi, Vaishnavi Karra, Won Suk Lee, Massimo Sorbara, Jorge Lubguban, Jae Kyu Cho, Rongtao Cao, Hanyi Ding, Sujith Chandran, Michal Rakowski, Abdelsalam Aboketaf, Subramanian Krishnamurthy, Scott Mills, Bo Peng, Jeff Pepper, Suruj Deka, Wen Feng, Steven Rishton, Marcel Boudreau, Dylan Logan, Ryan Hickey, Prova Christina Gomes, Kyle Murray, Arnab Dewanjee, Dave Riggs, Norman Robson, Ian Melville, Rod Augur, Robert Fox, Vikas Gupta, Anthony Yu, Ken Giewont, John Pellerin, Ted Letavic

Journal

IEEE Journal of Selected Topics in Quantum Electronics

Volume

29

Issue

3: Photon. Elec. Co-Inte. and Adv. Trans. Print.

Pages

1-19

Publisher

IEEE