Abstract

Photonic-integrated circuits (PICs) integrate photonics elements, such as light sources, passive and active components, along with electronics elements, such as drivers, amplifiers, and application-specific integrated circuits, on a homogeneous or a heterogeneous material platform for various applications, such as data centers, communications, LIDAR, sensors, and spectroscopy. These components are fabricated separately or assembled monolithically on the silicon line to form the PIC. This chapter discusses the various chip fabrication and testing schemes leading to high-volume manufacturing of the PIC, such as (1) hybrid, (2) heterogeneous, (3) monolithic, (4) fully monolithic on silicon, and (5) indium phosphide III–V material platforms.

Date

January 1, 2023

Authors

Ajey P Jacob, Sujith Chandran, Joris Van Campenhout, Marianna Pantouvaki, John Heck, Ken Giewont, Michal Rakowski, Yusheng Bian, Peter Debackere, Matthias Kuntz

Book

Integrated Photonics for Data Communication Applications

Pages

369-410

Publisher

Elsevier