Abstract

BACKGROUND
The accompanying drawings, which are incorporated in The present invention relates to photonics chips and, more and constitute a part of this specification, illustrate various specifically, to structures for an electro-optic modulator and embodiments of the invention and, together with a general methods of fabricating a structure for an electro-optic modu description of the invention given above and the detailed lator. 10 description of the embodiments given below, serve to Photonics chips are used in many applications and sys explain the embodiments of the invention. In the drawings, tems including, but not limited to, data communication like reference numerals refer to like features in the various systems and data computation systems. A photonics chip views. integrates optical components, such as waveguides, optical FIG. 1 is a diagrammatic top view of a photonics chip switches, and bends, and …

Metadata

publication

US Patent 10,649,245, 2020

year

2020

publication date

2020/5/12

authors

Y Bian, AP Jacob, A Thomas

link

https://patents.google.com/patent/US10649245B1/en

resource_link

https://patentimages.storage.googleapis.com/40/96/bc/506dbdd1784a98/US10649245.pdf

inventors

Yusheng Bian, Ajey Poovannummoottil Jacob, Abu Thomas

patent_office

US

patent_number

10649245

application_number

16298446