Abstract

The present disclosure generally relates to semiconductor structures and, more particularly, to non-planar waveguide structures and methods of manufacture. The waveguide structure includes: non-planar structures composed of a first material; a cladding layer over the non-planar structures composed of a second material; and a material formed over the cladding layer.

Metadata

publication

US Patent App. 15/725,524, 2019

year

2019

publication date

2019/4/11

authors

AP Jacob

link

https://patents.google.com/patent/US20190107672A1/en

resource_link

https://patentimages.storage.googleapis.com/52/e3/a3/c2c90b44dd093c/US20190107672A1.pdf

inventors

Ajey P Jacob

patent_office

US

application_number

15725524