Publications

Methods of forming NMOS and PMOS finFET devices and the resulting product

Abstract

A device includes an NMOS FinFET device including a first fin. The first fin includes a first strain relaxed buffer layer doped with carbon and a first channel semiconductor mate rial formed above the carbon-doped strain relaxed buffer layer. A PMOS FinFET device includes a second fin. The second fin includes a second strain relaxed buffer layer and a second channel semiconductor material formed above the carbon-doped strain relaxed buffer layer. A first gate struc ture is positioned around a portion of the NMOS fin. A second gate structure is positioned around a portion of the PMOS fin.

Metadata

publication
US Patent 10,056,300, 2018
year
2018
publication date
2018/8/21
authors
AP Jacob
link
https://patents.google.com/patent/US10056300B2/en
resource_link
https://patentimages.storage.googleapis.com/4c/ba/08/316997aab1124b/US10056300.pdf
inventors
Ajey Poovannummoottil Jacob
patent_office
US
patent_number
10056300
application_number
15729051