Publications
Semiconductor wafers with reduced bow and warpage
Abstract
The present disclosure relates to semiconductor structures and, more particularly, to semiconductor wafers with reduced bowing and warping and methods of manufacture.
- Date
- August 21, 2018
- Authors
- AP Jacob, SR Banna, DK Nayak, BJ Pawlak
- Inventors
- Ajey Poovannummoottil Jacob, Srinivasa R Banna, Deepak K Nayak, Bartlomiej J Pawlak
- Patent_office
- US
- Patent_number
- 10056453
- Application_number
- 15217643