Abstract

Programmable via devices and fabrication methods thereof are presented. The programmable via devices include, for instance, a first metal layer and a second metal layer electrically connected by a via link. The via link includes a semiconductor portion and a metal portion, where the via link facilitates programming of the programmable via device by applying a programming current through the via link to migrate materials between the semiconductor portion and the metal portion to facilitate a change of an electrical resistance of the via link. In one embodiment, the program ming current facilitates formation of at least one gap region within the via link, the at least one gap region facilitating the change of the electrical resistance of the via link. 16 Claims, 5 Drawing Sheets

Date

November 7, 2017

Authors

AP Jacob, SK Patil, MH Chi

Inventors

Ajey P Jacob, Suraj K Patil, Min-Hwa Chi

Patent_office

US

Patent_number

9812393

Application_number

14867341