Publications

Folded ballistic conductor interconnect line

Abstract

A method includes forming a folding template in a first dielectric layer. The folding template has a plurality of surfaces that are positioned in different planes. A ballistic conductor line is formed on the plurality of surfaces of the folding template. A device includes a first dielectric layer and a vertically folded line disposed in the first dielectric layer, the vertically folded line including a ballistic conductor material.

Metadata

publication
US Patent 9,633,947, 2017
year
2017
publication date
2017/4/25
authors
AP Jacob
link
https://patents.google.com/patent/US9633947B2/en
resource_link
https://patentimages.storage.googleapis.com/f7/ac/f0/85cc955696a901/US9633947.pdf
inventors
Ajey Poovannummoottil Jacob
patent_office
US
patent_number
9633947
application_number
14608337