Publications

Ultrathin oxynitridation process through ion implantation in a poly Si1− xGex gate MOS capacitor

Abstract

Effect of temperature and time of heat treatment on the distribution of ion-implanted nitrogen in poly Si0.65Ge0.35 gate MOS samples was studied. Secondary ion mass spectrometry (SIMS) was used for the qualitative analysis of the nitrogen distribution. Rapid thermal processing was carried out for a temperature range of 950–1070°C for the redistribution of ions. The nitrogen implantation doses were 5×1014cm−2, 2×1015cm−2 and 5×1015cm−2, all with an implantation energy of 50keV. For a uniform distribution of nitrogen in the SiO2 region, an optimal temperature at a well calibrated time must be applied and this depends on the implantation dose. For medium and high concentrations the optimal conditions were 1050°C and 15s, and 1070°C and 15s, respectively. A uniform nitrogen distribution could be obtained throughout the SiO2 film. Prolonged heat treatment can cause degradation of the oxide layer and …

Metadata

publication
Materials Science in Semiconductor Processing 6 (1-3), 37-41, 2003
year
2003
publication date
2003/2/1
authors
AP Jacob, T Myrberg, M Friesel, O Nur, Magnus Willander, U Serincan, RAŞİT Turan
link
https://www.sciencedirect.com/science/article/pii/S1369800103000696
resource_link
https://www.academia.edu/download/44745134/Ultrathin_oxynitridation_process_through20160414-32706-mcr40s.pdf
journal
Materials Science in Semiconductor Processing
volume
6
issue
1-3
pages
37-41
publisher
Pergamon